Number of pulse motor axes : 3 axes
XY stage for moving work (nozzle)
Coating material supplying syringe
Application hot plate : Up to 100℃
Bake hot plate : Up to 150℃
Gas control : Spray nozzle
Wrapping around wafer back side
Nozzle drying prevention : Immersion in cup (PEGMA, etc.)
Wafer supply : From airPLAD hs5.0
Parameter set
・Air pressure for spray (Atomization pressure)
・Feed amount for coating material supply syringe
・XY stage moving speed for work (nozzle) moving
・Specify XY stage position information for work (nozzle) moving